NA HANA HANA

NA WAFERS SILICON |ELECTRONIC COMPONENT

Nānā nui

ʻO nā holomua i ka hana wafer, simulation, MEMS, a me nanomanufacturing ua hoʻomaka i kahi au hou i ka ʻoihana semiconductor.Eia nō naʻe, ke hoʻokō ʻia nei ka hoʻoheheʻe ʻana o ka wafer silika e ka lapping mechanical a me ka polishing precision.ʻOiai ka nui o nā mea uila, e like me nā mea i hoʻohana ʻia i ka hana PCB, ua ulu nui, ʻo nā pilikia i ka mīkini i kuhikuhi ʻia ka mānoanoa a me ka roughness.

KA PONO O QUAL DIAMOND SLURRY a me ka pauda

Hoʻohana ʻia nā ʻāpana daimana Qual Diamond me ke kemika o ka honua.Hana ʻia nā matrixes kūikawā no nā slurries daimana like ʻole no nā noi like ʻole.ʻO kā mākou kaʻina hana hoʻomalu maikaʻi ISO-compliant, e komo pū ana me nā protocols sizing stringent a me nā loiloi elemental, e hōʻoia i ka hāʻawi ʻana i ka nui o ka nui daimana a me ka pae kiʻekiʻe o ka maʻemaʻe daimana.Hoʻololi ʻia kēia mau mea maikaʻi i ka wikiwiki o ka lawe ʻana i nā mea, ka hoʻokō ʻana i ka hoʻomanawanui paʻa, nā hopena kūlike, a me ka mālama kālā.

● Non-agglomeration ma muli o ka holomua ili lapaʻau o daimana particles.

● ʻO ka puʻunaue ʻana i ka nui paʻa ma muli o nā kuʻina hoʻopaʻa nui.

● Kiʻekiʻe kiʻekiʻe o ka maʻemaʻe daimana ma muli o ka mana o ka maikaʻi.

● Kiʻekiʻe mea hoʻoneʻe helu ma muli o ka non-agglomeration o daimana particles.

● Hoʻonohonoho kūikawā ʻia no ka poʻi pololei me ka pitch, ka pā, a me ka pā.

● Pono ka wai no ka hoʻomaʻemaʻe ʻana i nā kaʻina hana hoʻomaʻemaʻe

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Computer Electronic Components
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KA ILIKA WAFER LAPPING A POLISH

Hoʻohana nui ʻia nā wafers silikon i ka ʻoihana semiconductor.ʻO ke koi ʻana o ka mānoanoa o ka ʻaoʻao a me ka ʻaoʻao o kahi ʻāpana hana wafer, ʻo ia ke ʻano o ka hoʻomanawanui paʻa no ka lapping a me ka hoʻoliʻi pololei ʻana a he paʻakikī nui.ʻIke pū ʻia ka mānoanoa mīkini ʻole me ka hoʻohana ʻana i ka ʻenehana ʻike maka ma nā papa PCB, nā paʻa paʻakikī, nā peripherals kamepiula, a me nā mea uila ʻē aʻe a noho mau i kahi ʻano paʻakikī o ka hana ʻana.ʻO ka hapa nui o nā mīkini i hoʻohana ʻia i ka lapping a me ka pololei polishing wafers silikoni piha piha automated planetary polishing machines.Hoʻolālā ʻia lākou no nā ʻano nui o nā wafers a hoʻolako ʻia me ka hiki ke hāʻawi aku i ka slurry.

ʻO ka Diamond slurry kahi mea hoʻoneʻe waiwai maikaʻi loa a me nā mea hoʻonaninani no nā semiconductor a me nā mea uila.Ma ke ʻano he mea paʻakikī loa ma ka honua, ʻo nā ʻāpana daimana i loko o ka slurry e hāʻawi i ka hana hoʻoneʻe kiʻekiʻe a me ka pau ʻana o ka ʻili.Hiki ke hoʻomaka ka hoʻoheheʻe ʻana i ka wafer me ka hoʻolālā ʻana me nā slurries daimana ʻoi aku ka nui o ka grit, a ukali ʻia e nā sub-micron size slurries no nā pae hope o ka poʻi pololei.